第十八届IEEE国际固态和集成电路技术会议 (ICSICT 2026)
会议日期：2026.10.27 - 2026.10.30
地点：中国 杭州
会议组委会
Life Honorary Chair
Yangyuan Wang, Peking University, China
Advisory Committee Co-Chairs
Ting-Ao Tang, Fudan University, China
Cor Claeys, Proximus, Belgium
Mengqi Zhou, IEEE China Council, China
General Chairs
Jan Van der Spiegel, University of Pennsylvania, USA
Bin Zhao, IEEE EDS, USA
Francois Rivet, University of Bordeaux, France
Amara Amara, International Innovation Institute, Beihang University, Hangzhou Campus, China
General Co-Chairs
Ning Xu, Wuhan University of Technology, China
Cheng Zhuo, Zhejiang University, China
Yuehang Xu, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China
Gaofeng Wang, Hangzhou Dianzi University, China
Technical Program Committee Chairs
Haruo Kobayashi, Gunma University, Japan
Ming Li, Peking University, China
Bo Zhang, University of Electronic Science and Technology of China, China
Yi Zhao, Huada Semiconductor, China
Technical Program Committee Co-Chairs
Bei Yu, The Chinese University of Hong Kong, China
Zheng Wang, University of Electronic Science and Technology of China, China
Fakhrul Zaman Rokhani, Universiti Putra Malaysia, Malaysia
Ling Zhang, Zhejiang University, China
Yuchao Yang, Peking University, China
Jing Jin, Shanghai Jiao Tong University, China
Wentong Zhang, University of Electronic Science and Technology of China, China
Haifeng Ling, Nanjing University of Posts and Telecommunications, China
Local Arrangement Chair
Letian Huang, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China
Subcommittee Chairs
Haifeng Ling, Nanjing University of Posts and Telecommunications, China
Wentong Zhang, University of Electronic Science and Technology of China, China
Jing Jin, Shanghai Jiao Tong University, China
Yuchao Yang, Peking University, China
Subcommittee Co-Chairs
Hailong Jiao, Peking University, China
Zheng Wang, University of Electronic Science and Technology of China, China
Jin Wei, Peking University, China
Zhihao Yu, Nanjing University of Posts and Telecommunications, China
Special Session Chair
Haimeng Huang, University of Electronic Science and Technology of China, China
Kechao Tang, Peking University, China
Tutorial Chair
Wei Mao, Xidian University, China
Hua Fan, University of Electronic Science and Technology of China, China
Regional Chair
Lobna Said, Nile University, Egypt
Industry Liaison Chairs
Liguang Chen, Shanghai Anlogic Infotech Co., Ltd., China
Sylvain Eimer, Truth Equipment, China
Preet Yadav, NXP Semiconductors, India
Publicity Co-Chairs
Caoyu Li, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China
Chaoyue Zheng, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China
Publication Committee Chair
Mengqi Zhou, IEEE China Council, China
Publication Committee Co-chairs
Lobna A. Said, Nile University, Egypt
Guoqing Deng, Sichuan Institute of Electronics, China
Treasurer
Jianhong Zhou, Xihua University, China
Secretary General
Tiantian Han, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China
会议技术委员会
Teme 1: Digital & System Level IC
Chair: Yuchao Yang, Peking University, China
Co-Chair: Hailong Jiao, Peking University, China
Track 1: Digital Architectures & Systems
Chair:
Zhiyi Yu, Sun Yat-sen University, China
Co-Chairs:
Yaoyu Tao, Peking University, China
Hongyang Jia, Tsinghua University, China
Track 2: Digital Circuits
Chair:
Yongpan Liu, Tsinghua University, China
Co-Chairs:
Yanan Sun, Shanghai Jiao Tong University, China
Fengbin Tu, Hong Kong University of Science and Technology, China
Track 3: Design Methodology & EDA
Chair:
Jun Yang, Southeast University, China
Co-Chairs:
Yibo Lin, Peking University, China
Yu Li, Zhejiang University, China
Teme 2: Analog
Chair: Jing Jin, Shanghai Jiao Tong University, China
Co-Chair: Zheng Wang, University of Electronic Science and Technology of China, China
Track 4: RF & Wireless
Chair:
Keping Wang, Tianjin University, China
Co-Chairs:
Jian Pang, Shanghai Jiao Tong University, China
Kai Tang, Hunan University, China
Track 5: Wireline
Chair:
Xiaoyan Gui, Xi'an Jiaotong University, China
Co-Chairs:
Bingyi Ye, East China Normal University, China
Yuekang Guo, Shanghai Jiao Tong University, China
Track 6: General Analog
Chair:
Lin Cheng, University of Science and Technology of China, China
Co-Chairs:
Junmin Jiang, Southern University of Science and Technology, China
Ang Hu, Huazhong University of Science and Technology, China
Teme 3: Devices
Chair: Wentong Zhang, University of Electronic Science and Technology of China, China
Co-Chair: Jin Wei, Peking University, China
Track 7: CMOS Logic Devices & Sensors
Chair:
Heng Wu, Peking University, China
Co-Chairs:
Wang Kang, Beihang University, China
Xiaosheng Zhang, University of Electronic Science and Technology of China, China
Track 8: Power Devices & Power IC
Chair:
Long Zhang, Southeast University, China
Co-Chairs:
Jiafei Yao, Nanjing University of Posts and Telecommunications, China
Zekun Zhou, University of Electronic Science and Technology of China, China
Track 9: Device Reliability & Security
Chair:
Mengyuan Hua, Southern University of Science and Technology, China
Co-Chairs:
Sen Huang, Institute of Microelectronics of Chinese Academy of Sciences, China
Zhao Qi, University of Electronic Science and Technology of China, China
Teme 4: Process & Technologies
Chair: Haifeng Ling, Nanjing University of Posts and Telecommunications, China
Co-Chair: Zhihao Yu, Nanjing University of Posts and Telecommunications, China
Track 10: Semiconductor Process Technologies
Chair:
Bobo Tian, East China Normal University, China
Co-Chairs:
Min Liao, Xidian University, China
Li Zhu, Nanjing University of Posts and Telecommunications, China
Track 11: Optoelectronics and Silicon Photonics Integration
Chair:
Linfeng Sun, Beijing Institute of Technology, China
Co-Chairs:
Ming Xu, Huazhong University of Science and Technology, China
Yuanfang Yu, Nanjing University of Posts and Telecommunications, China
Track 12: Packaging Technologies
Chair:
Jun Zhang, Nanjing University of Posts and Telecommunications, China
Co-Chairs:
Shenyang Mo, NARI Semiconductor R&D Center, China
Pengfei Zhao, Nanjing University of Posts and Telecommunications, China
征稿主题:
ICSICT 2026征文范围如下（包括但不限于以下领域）
Teme 1: Digital & System Level IC
Track 1：Digital Architectures & Systems
FPGA Circuits Design & Application
Processors, Accelerators & SoCs
Memory System & Process in Memory
System Level Testability & Reliability
Track 2：Digital Circuits
Digital Blocks
Logical/Physical-Level Security
Non-volatile Memory & Volatile Memory
Circuit Level Reliability Design
Track 3：Design Methodology & EDA
Design for Testability, Reliability & Manufacturability
Modeling，Simulation & Emulation
Design & Technology Co-Optimization
Artificial Intelligence Algorithms for EDA
Theme 2: Analog
Track 4：RF & Wireless
Building Blocks at RF, mm-wave and THz
Rx, Tx or TRx for Wireless Systems
Wireless Sensor, Radar, Imager
Device/Packaging/Modeling at RF, mm-wave and THz
Track 5：Wireline
Electrical/Optical Transmitters/Receivers for Wireline
Clock Generation and Distribution Circuits
Building Blocks for High-Speed Wireline Communications
Track 6：General Analog
Advanced Analog Circuits
High-Speed, High-Precision Data Converters
Imagers, Medical Devices & Display Systems
Efficient Power Management Circuits
Theme 3: Devices
Track 7：CMOS Logic Devices & Sensors
Advanced CMOS Logic Devices
2D & Thin Film Devices & Technologies
Flash & Non-Volatile & 3D Memory Technologies
Sensor, Sensing Microsystem, MEMS, and Bioelectronics
Smart/Intelligent Sensors & Actuators
Device Modeling & Simulation
Track 8：Power Devices & Power IC
Silicon-based Power Devices
Wide Bandgap Power Devices
Power Integrated Circuits、modules & Systems
Power Integrating & Packaging Technology
Power Device Reliability
Power Device Modeling & Simulation
Track 9：Device Reliability & Security
Back-End of Line Reliability & ESD
Aging & Remaining Useful Lifetime Prediction
PUF & Hardware Security
Devices Radiation Reliability
Theme 4: Process & Technologies
Track 10：Semiconductor Process Technologies
Compound Semiconductor Materials & Technologies
Advanced Memory Materials & Technologies
Advanced Process Technologies
Advanced Interconnect Technologies
Process Modeling & Simulation
Track 11：Optoelectronics and Silicon Photonics Integration
High-Speed Optoelectronic Devices
Silicon Photonics & Integration
Photonic Sensors & Image Sensors
Optical Computing Devices
Display Process & Integration
Track 12：Packaging Technologies
2.5D & 3D Integration
Heterogeneous Integration Packaging
Advanced Wire Bonding Technology
Modeling and Simulation for Advanced Packaging
Testing and Reliability in Advanced Packaging
投稿方式：
投稿作者需按照论文模板撰写论文，提交至少3页的英文文章，被录用文章将收录于会议论文集。
投稿链接： http://www.icsict.org
下载论文模板：https://www.icsict.org/ICSICT_Paper_Template.docx
组织特别分会：
ICSICT 2026组委会邀请专家学者积极组织特别分会，展示自己的先进研究成果！
有意组织的学者请在2026年2月1日前将提案发送至会议邮箱。（ieeeicsict@outlook.com）
下载提案模板：https://www.icsict.org/ICSICT_2026_Special_Session_Proposal_Template.docx
联系方式：
会议秘书：钟女士
联系电话：+86-186 282 638 76
会议邮箱：icsict2026@csj.uestc.edu.cn | ieeeicsict@outlook.com
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