2018 - CFP: SS on Emerging Wireless Technologies for IIoTs in IECON 2018
来源: 舒磊/
南京农业大学/英国林肯大学
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2018-06-18

CALL FOR PAPERS

 

 

Special Session on Emerging Wireless Technologies for Industrial Internet of Things (IIoT)

 

IECON 2018 - The 44th Annual Conference of the IEEE Industrial Electronics Society

October 21-23, 2018, Washington D.C, USA

 


 

TOPIC OF THE   SPECIAL SESSION

 

The IoT paradigm is envisaged to permeate into the industrial manufacturing and production, leading to Industrial Internet of Things (IIoT). There are many emerging wireless technologies, such as LoRa, Sigfox, Weightless, NB-IoT and LTE Cat M1, which can be applied to the current and future IIoT applications. However, there are many challenges and research gaps that still need to be addressed to improve the performance of these emerging wireless technologies. Furthermore, there are many enabling technologies, such as software-defined networking and cloud and fog computing, that can be utilized to overcome many challenges associated with these emerging wireless technologies. Researchers are invited to submit original research contributions in all related areas.

Topics of the Session

Ø IIoT analytics architectures, algorithms and applications

Ø Simulation, testbeds, prototypes, field trails, and other performance analysis of the emerging wireless technologies for IIoT

Ø Concepts and business models for IIoT computing and communication

Ø Software-defined IIoT architecture, controller, security and standardization

Ø Edge, fog and cloud computing for IIoT;

Ø Energy efficiency and energy harvesting for IIoT; and

Ø Lightweight IIoT security protocols for emerging wireless technologies



 

ORGANIZED AND CO-CHAIRED BY

 

Adnan M. Abu-Mahfouz 

a.abumahfouz@ieee.org

 

Gerhard P. Hancke

g.hancke@ieee.org

 

Lei Shu

lei.shu@ieee.org

 

Chunsheng Zhu

cszhu@ece.ubc.ca


 

 

 


Author’s schedule:

 

Ø Deadline for submission of special session papers

June 30, 2018

Ø Notification of acceptance

July 15, 2018

Ø Deadline for submission of final manuscripts

August 1, 2018


 

 

 

 

 

 

 

 

 

 

 

 

 

 

 



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